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TECHNICAL PAPERS

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

[+] Author and Article Information
Anand M. Deshpande, Ganesh Subbarayan

Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309-0427

J. Electron. Packag 122(1), 13-19 (Aug 13, 1999) (7 pages) doi:10.1115/1.483126 History: Received February 10, 1999; Revised August 13, 1999
Copyright © 2000 by ASME
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References

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Deshpande, A. M., Subbarayan, G., and Rose, D., 1998, “A System for First Order Reliability Estimation Of Solder Joints In Area Array Packages,” presented at the 1998 ASME International Mechanical Engineering Congress and Exhibition, Nov. 15–21, Anaheim, CA.
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Figures

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Decomposition of electronic packages
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Interfacial (linking) variables in the package decomposition
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A typical finite element model of the solder joint
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The cross-section of the hypothetical 5×5 package used as a demonstration problem
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The three-dimensional model of the 5×5 package used for verification of decomposition results
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A tool for reliability estimation based on known displacements

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