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TECHNICAL PAPERS

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

[+] Author and Article Information
Anand M. Deshpande, Ganesh Subbarayan

Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309-0427

J. Electron. Packag 122(1), 13-19 (Aug 13, 1999) (7 pages) doi:10.1115/1.483126 History: Received February 10, 1999; Revised August 13, 1999
Copyright © 2000 by ASME
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References

Figures

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Decomposition of electronic packages
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Interfacial (linking) variables in the package decomposition
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A typical finite element model of the solder joint
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The cross-section of the hypothetical 5×5 package used as a demonstration problem
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The three-dimensional model of the 5×5 package used for verification of decomposition results
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A tool for reliability estimation based on known displacements

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