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TECHNICAL PAPERS

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

[+] Author and Article Information
Anand M. Deshpande, Ganesh Subbarayan

Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309-0427

Dan Rose

Storage Technology Corporation, Louisville, CO 80028-9152

J. Electron. Packag 122(1), 6-12 (Dec 09, 1999) (7 pages) doi:10.1115/1.483125 History: Received July 29, 1998; Revised December 09, 1999
Copyright © 2000 by ASME
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References

Figures

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Moiré analysis of 225 I/O PBGA: (a) fringe patterns; (b) shear deformation across solder joints
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Schematic illustration of CAD system for flip-chip/BGA solder joints
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A typical finite element model of a solder joint
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Schematic of the structure of an ANN model
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The dialogue box for the model to quickly estimate reliability

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