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TECHNICAL PAPERS

Alternative Curing Methods for FCOB Underfill

[+] Author and Article Information
M. M. Merton

Hewlett-Packard, 3404 E. Harmony Road, MS A56L, Ft. Collins, CO 80525

C. P. Malhotra, R. L. Mahajan

CAMPmode, Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427

N. Nikmanesh

Lucent Technologies, 1200 W. 120th Street, Westminster, CO 80234

J. Electron. Packag 121(4), 249-254 (Dec 01, 1999) (6 pages) doi:10.1115/1.2793848 History: Received January 15, 1999; Revised July 20, 1999; Online November 05, 2007

Abstract

This paper explores the use of liquid immersion and vapor condensation curing as alternatives to conventional hot air oven curing of flip chip on board underfill. Heat transfer results suggest that both the liquid immersion and vapor condensation heating result in reduced cure times due to higher heat transfer results associated with these two techniques. Preliminary reliability studies Suggest that the two proposed rapid curing methods do not result in any increased failure rates or different failure mechanisms. In almost all the samples the failure mode was delamination of the underfill followed by solder fatigue failure.

Copyright © 1999 by The American Society of Mechanical Engineers
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