Thermal Management in Direct Chip Attach Assemblies

[+] Author and Article Information
D. F. Baldwin, J. T. Beerensson

Advanced Assembly Process Technology (AAPT) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 813 Ferst Dr., N. W., Atlanta, GA 30332-0405

J. Electron. Packag 121(4), 222-230 (Dec 01, 1999) (9 pages) doi:10.1115/1.2793844 History: Received September 17, 1997; Revised May 21, 1999; Online November 05, 2007


Direct chip attach (DCA) packaging technologies are finding increasing application in electronics manufacturing particularly in telecommunications and consumer electronics. In these systems, bare die are interconnected directly to a printed circuit board. The two primary forms of DCA included chip on board (COB) where the die are attached face up and wirebonded to the substrate and flip chip on board (FCOB) where bumped die are interconnected active face down directly to low-cost organic substrates. In the current work, thermal management of four direct chip attach technologies is investigated. Experimental measurements are conducted exploring the junction-to-ambient thermal resistance and thermal dissipation paths for COB interconnection and three FCOB interconnect technologies including solder attach, anisotropic adhesive attach, and isotropic adhesive attach. A first-order chip-scale thermal design model is developed for flip chip assemblies exhibiting good agreement with the experimental measurements.

Copyright © 1999 by The American Society of Mechanical Engineers
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