Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

[+] Author and Article Information
X. Q. Shi, Z. P. Wang

Gintic Institute of Manufacturing Technology, Nanyang Drive, Sigapore 638075

W. Zhou, H. L. J. Pang

School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

J. Electron. Packag 121(3), 179-185 (Sep 01, 1999) (7 pages) doi:10.1115/1.2792681 History: Received September 01, 1998; Revised April 19, 1999; Online November 05, 2007


In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.

Copyright © 1999 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In