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TECHNICAL PAPERS

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

[+] Author and Article Information
Z. Qian, W. Ren, S. Liu

Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202

J. Electron. Packag 121(3), 162-168 (Sep 01, 1999) (7 pages) doi:10.1115/1.2792679 History: Received January 01, 1998; Revised May 03, 1999; Online November 05, 2007

Abstract

A damage coupling framework is proposed with a unified viscoplastic constitutive model for the fatigue life prediction of solder alloys, including a consistent and systematic procedure for the determination of material parameters. The model also incorporates the effects of grain size and cyclic hardening/softening. The phenomenological framework of continuum damage mechanics (CDM) is modified to embed intensive researches on the ductile damage fracture by void nucleation, growth, and coalescence, based on a lower bound for the viscoplastic potential of voided materials. The damage coupling with elasticity and viscoplasticity is formulated by irreversible thermodynamic approach. The constitutive model is also extended to large deformation kinematics. The preliminary application of the model to creep damage is presented.

Copyright © 1999 by The American Society of Mechanical Engineers
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