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TECHNICAL PAPERS

Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components

[+] Author and Article Information
N. van Veen

Nederlandse Philips Bedrijven, Centre for Manufacturing Technology, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

J. Electron. Packag 121(2), 116-121 (Jun 01, 1999) (6 pages) doi:10.1115/1.2792665 History: Received January 01, 1998; Revised January 21, 1999; Online November 05, 2007

Abstract

A component aligned through the use of liquid solder bumps behaves like a mechanical oscillator system. The force constants for liquid solder bumps are derived analytically for simple model systems as well the damping factor and the resonance spectrum. It appears that for practical bump sizes the force constant in the vertical direction is an order of magnitude larger than the horizontal one. The damping factor is small and the system can easily be brought into resonance. From the derivation of the force constants combined with the dissociation energy a Morse potential can be constructed depicting the asymmetry in the potential energy curve.

Copyright © 1999 by The American Society of Mechanical Engineers
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