Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

[+] Author and Article Information
N. R. Sottos, J. M. Ockers, M. Swindeman

University of Illinois at Urbana-Champaign, Department of Theoretical and Applied Mechanics, 216 Talbot Laboratory, 104 South Wright Street, Urbana, IL 61801

J. Electron. Packag 121(1), 37-43 (Mar 01, 1999) (7 pages) doi:10.1115/1.2792659 History: Received September 01, 1995; Revised September 28, 1998; Online November 05, 2007


The thermoelastic properties of woven glass/epoxy substrates for multilayer circuit board applications were investigated and the influence of fabric geometry assessed. The woven fabric geometry of several commercially pressed boards was carefully characterized using optical microscopy. The elastic moduli and Poisson’s ratios were then measured in uniaxial tension, while the CTEs of the boards were measured using thermal mechanical analysis (TMA) at temperatures above and below the glass transition. Experimental data were compared to predictions from two new analytical models. One of the models, which does not use classical lamination theory, results in a significant improvement for the prediction of Poisson’s ratio and CTEs. Finally, a parametric study was performed to demonstrate the effect of fiber crimp on the properties of the fabric.

Copyright © 1999 by The American Society of Mechanical Engineers
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