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TECHNICAL PAPERS

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications

[+] Author and Article Information
C. Basaran

Electronic Packaging Laboratory, State University of New York at Buffalo, Buffalo, NY 14260

R. Chandaroy

HKS ABAQUS Inc., Detroit, MI

J. Electron. Packag 121(1), 12-17 (Mar 01, 1999) (6 pages) doi:10.1115/1.2792654 History: Received March 05, 1998; Revised April 26, 1998; Online November 05, 2007

Abstract

Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied for low cycle and high cycle fatigue. Thermal effects were not included in order to understand the dynamic behavior of a Pb40/Sn60 solder joint without noise-effects from thermal behavior. The latter decision was a result of observations reported in Steinberg (1988), that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the fatigue life. The study of fatigue under concurrent loading will be the subject of another paper.

Copyright © 1999 by The American Society of Mechanical Engineers
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