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SPECIAL SECTION TECHNICAL PAPERS

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

[+] Author and Article Information
J. Jiao

Motorola Inc., Automotive and Industrial Electronics Group, 4000 Commercial Avenue, Northbrook, IL 60062

C. K. Gurumurthy, E. J. Kramer

Department of Materials, University of California, Santa Barbara, Santa Barbara, CA 93106

Y. Sha

Intel Corporation, Chandler, AZ 85226

C. Y. Hui

Theoretical and Applied Mechanics Department, Cornell University, Ithaca, NY 14850

P. Borgesen

Universal Instruments Corporation, Binghamton, NY 13902

J. Electron. Packag 120(4), 349-353 (Dec 01, 1998) (5 pages) doi:10.1115/1.2792645 History: Received May 03, 1998; Revised July 30, 1998; Online November 06, 2007

Abstract

The interfacial fracture resistance of a polyimide passivation/underfill interface was measured using an asymmetric double cantilever beam technique. A thin layer of polyimide was coated on a standard epoxy as one of the beams and an underfill was flowed over the polyimide film and cured to form the second beam. The relative contributions of the thermal and mechanical stress were systematically varied by varying the thickness ratio of the two beams. The results indicate that the effect of thermal residual stress must be taken into account in the calculation of critical strain energy release rate to obtain the interfacial fracture energy.

Copyright © 1998 by The American Society of Mechanical Engineers
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