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SPECIAL SECTION TECHNICAL PAPERS

Adhesion and Reliability of Polymer/Inorganic Interfaces

[+] Author and Article Information
S.-Y. Kook, J. M. Snodgrass, R. H. Dauskardt

Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205

A. Kirtikar

Assembly Technology, INTEL Corporation, Chandler, AZ 85226

J. Electron. Packag 120(4), 328-335 (Dec 01, 1998) (8 pages) doi:10.1115/1.2792642 History: Received May 15, 1998; Revised August 10, 1998; Online November 06, 2007

Abstract

The reliability of microelectronic components is profoundly influenced by the interfacial fracture resistance (adhesion) and associated progressive debonding behavior. In this study we examine the interfacial fracture properties of representative polymer interfaces commonly found in microelectronic applications. Specifically, interface fracture mechanics techniques are described to characterize adhesion and progressive bebonding behavior of a polymer/metal interface under monotonic and cyclic fatigue loading conditions. Cyclic fatigue debond-growth rates were measured from ~10−11 to 10−6 m/cycle and found to display a power–law dependence on the applied strain energy release rate range, ΔG. Fracture toughness test results show that the interfaces typically exhibit resistance-curve behavior, with a plateau interface fracture resistance, Gss , strongly dependent on the interface morphology and the thickness of the polymer layer. The effect of a chemical adhesion promoter on the fracture energy of a polymer/silicon interface was also characterized. Micromechanisms controlling interfacial adhesion and progressive debonding are discussed in terms of the prevailing deformation mechanisms and related to interface structure and morphology.

Copyright © 1998 by The American Society of Mechanical Engineers
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