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TECHNICAL PAPERS

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

[+] Author and Article Information
H. Lu

Applied Simulation and Modeling Research, Corporate Software Center, Motorola, Inc., 1303 E. Algonquin Rd., Schaumburg, IL 60196-1079

J. Electron. Packag 120(3), 275-279 (Sep 01, 1998) (5 pages) doi:10.1115/1.2792633 History: Received December 01, 1997; Revised January 29, 1998; Online December 05, 2007

Abstract

The method of digital speckle correlation is introduced, and so is the hardware system to implement the method. The advantages and the features of the technique are discussed, and application examples are given. Owing to the high spatial resolution that this technique can achieve, the method is especially useful in measuring small areas of an object, or a small component in an assembly, whether the surfaces under probing are planar or not. The applications have proved that the technique is a promising tool for the reliability study of microelectronic packages.

Copyright © 1998 by The American Society of Mechanical Engineers
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