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TECHNICAL PAPERS

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moiré Interferometry

[+] Author and Article Information
H. Krishnamoorthy, H. V. Tippur

Failure Characterization & Optical Techniques Lab, Department of Mechanical Engineering, Auburn University, 202 Ross Hall, Auburn, AL 36849-5341

J. Electron. Packag 120(3), 267-274 (Sep 01, 1998) (8 pages) doi:10.1115/1.2792632 History: Received February 25, 1997; Revised March 24, 1998; Online December 05, 2007

Abstract

An experimental investigation dealing with failure characterization of 63/37 solder-copper interfaces is presented. The method of moiré interferometry is used for mapping elasto-plastic deformations in bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter—the J-integral—using full-field measurement of crack opening displacements has been developed. A linear relationship between crack tip opening displacements (CTOD) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness Jc value for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage for fracture testing of interfaces with large mismatch in this geometry.

Copyright © 1998 by The American Society of Mechanical Engineers
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