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TECHNICAL PAPERS

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

[+] Author and Article Information
Y. Kondo, H. Matsushima

Mechanical Engineering Research Laboratory, Hitachi, Ltd., Tsuchiura, Ibaraki 300, Japan

M. Behnia

School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW 2052, Australia

W. Nakayama

CALCE EPRC, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742-7625

J. Electron. Packag 120(3), 259-266 (Sep 01, 1998) (8 pages) doi:10.1115/1.2792631 History: Received October 25, 1996; Revised May 19, 1997; Online December 05, 2007

Abstract

The study of optimization of finned heat sinks for impingement cooling of electronic components was undertaken. The procedure was based on a semiempirical zonal approach to the determination of thermal resistance as well as pressure drop. To test the validity of the model’s predictions, experiments and CFD (computational fluid dynamics) simulations were performed. The results provided support for the approach. The model enables cost-effective design calculations to be performed for the optimization of heat sinks. We performed such calculations to optimize an LSI heat sink in consideration of sixteen design parameters, including fin thickness, fin spacing, fin height, and flow-orifice dimensions. For the particular application considered in our study, the optimum fin thickness was found to be 0.15 mm. The characteristics and limitations of air cooling for such applications were investigated under various conditions.

Copyright © 1998 by The American Society of Mechanical Engineers
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