Avionics Passive Cooling With Microencapsulated Phase Change Materials

[+] Author and Article Information
A. J. Fossett, M. T. Maguire

Frisby Technologies, Inc., 4520 Hampton Road, Clemmons, NC 27012

A. A. Kudirka, F. E. Mills

Lockheed Martin Skunk Works, Department 25/22, Building 611, Plant 10, 1011 Lockheed Way, Palmdale, CA 93599-2522

D. A. Brown

Wright Laboratory, Wright Patterson Air Force Base, 2130 Eighth Street, Wright-Patterson AFB, OH 45433-7542

J. Electron. Packag 120(3), 238-242 (Sep 01, 1998) (5 pages) doi:10.1115/1.2792628 History: Received August 15, 1997; Revised April 09, 1998; Online December 05, 2007


Analysis for an avionics application typical of remotely located, intermittently operated avionics on aircraft and missiles show that a large weight reduction (about 9:1) can be obtained by using recently developed microencapsulated phase change materials technology instead of a solid aluminum plate for a passive heat sink. Tests with a configuration based on the typical avionics application used for analysis show good agreement with analysis. Use of microencapsulated rather than bulk phase change materials avoids a number of design problems previously encountered with application of such materials.

Copyright © 1998 by The American Society of Mechanical Engineers
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