Thermal Enhancement Coatings for Microelectronic Systems

[+] Author and Article Information
L. S. Fletcher

Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

M. A. Lambert

Department of Mechanical Engineering, San Jose State University, San Jose, CA 95192-0087

E. E. Marotta

Department of Mechanical Engineering, Clemson University, Clemson, SC 29634

J. Electron. Packag 120(3), 229-237 (Sep 01, 1998) (9 pages) doi:10.1115/1.2792627 History: Received November 07, 1995; Revised January 20, 1998; Online December 05, 2007


The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of thermally-induced failures in these systems, their thermal performance has become the focus of increasing concern. The use of thermally conducting interstitial coatings within and between electronic components has proven to be one technique suitable for thermal enhancement. This review will address both metallic and nonmetallic coatings suitable for thermal enhancement and discuss some of the major areas of application.

Copyright © 1998 by The American Society of Mechanical Engineers
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