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SPECIAL SECTION TECHNICAL PAPERS

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

[+] Author and Article Information
K.-N. Chiang

Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P. O. Box 19-136, Hsinchu, Taiwan

W.-L. Chen

Department of Industrial Design, Chao Yang University of Technology, 168 Gifeng E. Rd., Wufeng, Taiwan

J. Electron. Packag 120(2), 175-178 (Jun 01, 1998) (4 pages) doi:10.1115/1.2792616 History: Received November 01, 1997; Revised January 29, 1998; Online November 06, 2007

Abstract

The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for its practical engineering application. Many solder joint models have been developed based on energy minimization principle (Patra et al., 1995) or analytical method (Heinrich et al., 1993; Liedtke 1993). These methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method in real application. In this study, an efficient numerical method used to predict the shapes of solder joint is investigated, and the results are compared with Surface Evolver program (Brakke, 1994). The changes of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influences of the geometric parameters, such as volumes of solder joint, package weight, contact angles, pads sizes, solder surface tension, and gravity forces to the shape of solder joint, are investigated. Results presented in this study can be used to determined the optimally balanced stand-off height of single ball module (SBM) or multiple ball module (MBM) solder joint models.

Copyright © 1998 by The American Society of Mechanical Engineers
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