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SPECIAL SECTION TECHNICAL PAPERS

An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

[+] Author and Article Information
H. C. Cheng, K. N. Chiang, M. H. Lee

Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.

J. Electron. Packag 120(2), 129-134 (Jun 01, 1998) (6 pages) doi:10.1115/1.2792597 History: Received December 21, 1997; Revised January 29, 1998; Online November 06, 2007

Abstract

In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved equivalent model for the use in the local/global analysis, and most importantly, provide a systematic procedure in approaching this equivalent model. In addition, the choice of the equivalent beam model will also be extensively investigated. Since the configuration of the solder joint is far from being close to a “beam-like” structure, defining the corresponding equivalent beam involves great levels of difficulties. In order to remove the possible difficulties, an effective way is proposed: incorporating analytical derivations and optimization. To this end, one practical application is presented to substantiate the proposed methodology.

Copyright © 1998 by The American Society of Mechanical Engineers
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