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TECHNICAL PAPERS

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

[+] Author and Article Information
C. S. Desai, J. Chia, T. Kundu

Department of Civil Engineering and Engineering Mechanics, The University of Arizona, Tucson, AZ 85721

J. L. Prince

Department of Electrical and Computer Engineering, The University of Arizona, Tucson, AZ 85721

J. Electron. Packag 119(4), 301-309 (Dec 01, 1997) (9 pages) doi:10.1115/1.2792253 History: Received April 24, 1995; Revised November 01, 1996; Online November 06, 2007

Abstract

The constitutive modeling approach based on the disturbed state concept (DSC) described in Part I, provides a unified basis for the characterization of thermomechanical response of materials and joints in electronic chip-substrate systems. Using the material constants given in Part I, the DSC model predictions, obtained by integrating the incremental constitutive equations, are shown here to provide satisfactory backpredietions of stress-strain, fatigue, and failure responses of typical solder materials. The DSC also provides a simple criterion based on the critical disturbance to identify cyclic fatigue failure. Model predictions show good correlation with those from previous models. It is also shown how the DSC model can be used for design applications. Overall, based on Papers I and II, it can be stated that the DSC can provide a new and powerful means to characterize the thermomechanical behavior of materials and joints in a number of problems in electronic packaging.

Copyright © 1997 by The American Society of Mechanical Engineers
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