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TECHNICAL PAPERS

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

[+] Author and Article Information
R. C. Dunne, S. K. Sitaraman

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 119(3), 197-203 (Sep 01, 1997) (7 pages) doi:10.1115/1.2792234 History: Received July 15, 1996; Revised March 01, 1997; Online November 06, 2007

Abstract

The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses near the free edge, which might initiate delamination and subsequent failure of the electronic component. The effect of some key parameters—base layer material, interlayer dielectric material, base layer thickness, and temperature range—on substrate warpage and interfacial shear and peel stress distribution is presented. Material and design recommendations for improved thermomechanical response are suggested based on this initial parametric study.

Copyright © 1997 by The American Society of Mechanical Engineers
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