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TECHNICAL PAPERS

Maximizing Solder Joint Reliability Through Optimal Shape Design

[+] Author and Article Information
A. M. Deshpande, G. Subbarayan, R. L. Mahajan

Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309-0427

J. Electron. Packag 119(3), 149-155 (Sep 01, 1997) (7 pages) doi:10.1115/1.2792227 History: Received July 15, 1996; Revised March 01, 1997; Online November 06, 2007

Abstract

The automated search techniques from the field of numerical optimization provide tools that enable optimal design of electronic packages in general, and solder joints in particular. However, there is considerable difficulty in using these procedures for solder joints since the estimation of fatigue life is computationally very expensive. In this paper, global approximation schemes based on designed experiments, linear regression models, and artificial neural network models are developed to approximate the fatigue life as a function of solder joint design parameters. Since these approximate surfaces are inexpensive to evaluate, their use with the numerical optimization techniques leads to a computationally efficient method for optimizing electronic packages. The developed techniques are demonstrated using the 225 I/O Plastic Ball Grid Array (PBGA) package, manufactured by Motorola, Inc. An exact optimization of the solder joints (without approximations) is also carried out and used as a basis for comparing the accuracy and efficiency of the developed methods.

Copyright © 1997 by The American Society of Mechanical Engineers
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