0
TECHNICAL PAPERS

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

[+] Author and Article Information
S. A. Taylor, R. Mahajan

Intel Corporation, Chandler, AZ 85226

K. Chen

Mechanical Engineering Department, University of Utah, Salt Lake City, UT 84112

J. Electron. Packag 119(2), 85-88 (Jun 01, 1997) (4 pages) doi:10.1115/1.2792224 History: Revised November 01, 1996; Online November 06, 2007

Abstract

Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended time to determine its equilibrium moisture composition as a function of environmental moisture level. An IR (infrared) heating test was designed to simulate the high-temperature heat reflow process when PQFPs are soldered on computer boards. The C-SAM (C-mode Scanning Acoustic Microscopy) technique was employed to measure the delaminated areas. All packages failed after IR heating when the moisture content in PQFPs was higher than 60 percent of the equilibrium composition.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In