Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

[+] Author and Article Information
S. A. Taylor, R. Mahajan

Intel Corporation, Chandler, AZ 85226

K. Chen

Mechanical Engineering Department, University of Utah, Salt Lake City, UT 84112

J. Electron. Packag 119(2), 85-88 (Jun 01, 1997) (4 pages) doi:10.1115/1.2792224 History: Revised November 01, 1996; Online November 06, 2007


Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended time to determine its equilibrium moisture composition as a function of environmental moisture level. An IR (infrared) heating test was designed to simulate the high-temperature heat reflow process when PQFPs are soldered on computer boards. The C-SAM (C-mode Scanning Acoustic Microscopy) technique was employed to measure the delaminated areas. All packages failed after IR heating when the moisture content in PQFPs was higher than 60 percent of the equilibrium composition.

Copyright © 1997 by The American Society of Mechanical Engineers
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