The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear

[+] Author and Article Information
A. Gilat, K. Krishna

The Ohio State University, Department of Engineering Mechanics, 155 W. Woodruff Avenue, Columbus, OH 43210

J. Electron. Packag 119(2), 81-84 (Jun 01, 1997) (4 pages) doi:10.1115/1.2792223 History: Revised August 01, 1996; Online November 06, 2007


A new configuration for testing thin layers of solder is introduced and employed to study the effects of strain rate and thickness on the mechanical response of eutectic Sn-Pb solder. The solder in the test is loaded under a well defined state of pure shear stress. The stress and deformation in the solder are measured very accurately to produce a reliable stress-strain curve. The results show that both the stress needed for plastic deformation and ductility increase with increasing strain rate.

Copyright © 1997 by The American Society of Mechanical Engineers
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