Thermal Analysis and Optimization of Substrates With Directionally Enhanced Conductivities

[+] Author and Article Information
K. K. Sikka, T. S. Fisher, K. E. Torrance

Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY 14853

J. Electron. Packag 119(1), 64-72 (Mar 01, 1997) (9 pages) doi:10.1115/1.2792202 History: Received January 01, 1996; Revised October 18, 1996; Online November 06, 2007


An approximate analytical solution for the thermal resistance of the axisymmetric chip-on-substrate problem is presented for a substrate with a direction dependent (orthotropic) thermal conductivity. The substrate may be convectively cooled on either, or both, of its planar surfaces. The solution reveals substrate geometries with low maximum substrate temperatures. These optimal substrate sizes are mapped for Biot numbers typical of microelectronic applications. The effects of varying the radial and axial substrate conductivities are investigated. In general, radial conductivity enhancement is beneficial for bottom-side and both-side convective cooling of thin substrates, and for top-side cooling of all substrates. For thin substrates, radial conductivity enhancement provides comparable thermal performance to an equivalent isotropic conductivity enhancement. For electronic packaging applications thin substrates are desirable and radial conductivity enhancement is more beneficial than axial conductivity enhancement.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.







Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In