0
TECHNICAL PAPERS

A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With a Porous Heat Sink

[+] Author and Article Information
A. G. Fedorov, R. Viskanta

Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

J. Electron. Packag 119(1), 8-16 (Mar 01, 1997) (9 pages) doi:10.1115/1.2792207 History: Received January 01, 1996; Revised January 01, 1996; Online November 06, 2007

Abstract

A physical/mathematical model has been developed to simulate the conjugate heat transfer in an actively cooled electronic package. The package consists of a highly conductive substrate with embedded discrete heat sources that are in intimate contact with a porous channel through which a gaseous coolant is circulated. The flow in the porous medium is analyzed using the extended Darcy model. The nonequilibrium, two-equation model which accounts for the near wall thermal dispersion effects was used for the heat transfer analysis. The concept of the general energy equation for the entire physical domain was employed as a method of solving numerically the conjugate system. The model has been validated by comparing the predictions with available experimental data for a similar system. A parametric study has been performed to examine the effects of some of the most important model parameters on the thermal performance of porous heat sink.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In