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TECHNICAL PAPERS

Ball Grid Array Thermomechanical Response During Reflow Assembly

[+] Author and Article Information
T. E. Voth

Thermal Sciences Department, Sandia National Laboratories, Albuquerque, NM 87185–0835

T. L. Bergman

Department of Mechanical Engineering, The University of Connecticut, Storrs, CT 06269–3139

J. Electron. Packag 118(4), 214-222 (Dec 01, 1996) (9 pages) doi:10.1115/1.2792155 History: Received May 15, 1995; Revised April 01, 1996; Online December 05, 2007

Abstract

The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide development of a process model capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system’s thermomechanical response to thermal and mechanical processing conditions, as well as component properties. High thermal conductivity assemblies show the greatest sensitivity to mechanical loading conditions.

Copyright © 1996 by The American Society of Mechanical Engineers
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