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TECHNICAL PAPERS

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

[+] Author and Article Information
J. K. Shang, Daping Yao

Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801

J. Electron. Packag 118(3), 170-173 (Sep 01, 1996) (4 pages) doi:10.1115/1.2792148 History: Received January 01, 1996; Revised April 01, 1996; Online November 06, 2007

Abstract

The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.

Copyright © 1996 by The American Society of Mechanical Engineers
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