Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

[+] Author and Article Information
Scott Anson

Universal Instruments Corp., Binghamton, NY 13902-0825

C. Sahay

Department of Mechanical Engineering, Thomas J. Watson School of Engineering, Binghamton University, Binghamton, NY 13902-6000

Linda Head, James Constable

Department of Electrical Engineering, Thomas J. Watson School of Engineering, Binghamton University, Binghamton, NY 13902-6000

J. Electron. Packag 118(2), 94-100 (Jun 01, 1996) (7 pages) doi:10.1115/1.2792138 History: Received January 01, 1996; Revised March 01, 1996; Online November 06, 2007


Solder paste is used in the electronics industry to connect surface mount circuit components to printed wiring boards. A printed wire board (PWB) is populated with components by applying solder paste on the PWB, placing components and finally reflowing the solder paste in an oven. Between the time the component is placed on the PWB and the solder paste is reflowed, the components are to be held in position. This is helped by tackiness of the paste. The present paper describes an experimental investigation of the tack strength of three solder pastes with probe size, probe surface roughness, drying time, and surrounding pressure. The results indicate that the probe size has a significant and dominant effect on all the pastes examined. A Mechanistic view of the possible mechanism for this phenomenon is also presented. Measured tack strength is shown not to be simple adhesion, but to include a vacuum under the test probe that increases tack strength (force per unit area) as probe size increases.

Copyright © 1996 by The American Society of Mechanical Engineers
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