A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

[+] Author and Article Information
Zequn Mei, Helen Holder

Electronic Assembly Development Center, Hewlett-Packard Company, 1501 Page Mill Road, Palo Alto, CA 94034

J. Electron. Packag 118(2), 62-66 (Jun 01, 1996) (5 pages) doi:10.1115/1.2792133 History: Received January 01, 1996; Revised March 01, 1996; Online November 06, 2007


Surface mount components soldered with 58Bi–42Sn on printed circuit boards fell off after about 500 cycles of−45°C ↔ 100°C in a thermal chamber. Failure analysis revealed that the failure was caused by dissolving of Pb from either HAL (hot air leveled) board surfaces or component lead coatings into the Bi-Sn solder joints, forming 52Bi–32Pb–16Sn eutectic phase that melts at 95°C. The dissolving of Pb occurred primarily at reflow, when the Bi-Sn was molten. During the thermal cycling, the small amount (<7 volume % of a Bi-Sn solder joint) of the low melting eutectic phase provided liquid channels for fast atom transportation, causing exceptionally significant grain growth and phase agglomeration in the whole volume of the solder joint, which in turn caused dramatic reduction in mechanical strength of the solder joints. Solutions to the failure may be either using Pb-free coating on both board surfaces and component leads, or limiting the product service temperature to below 95°C.

Copyright © 1996 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In