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TECHNICAL PAPERS

Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

[+] Author and Article Information
R. J. Iannuzzelli

Process Reliability and Advanced Development, Digital Equipment Corporation, Maynard, MA 01754

J. M. Pitarresi, V. Prakash

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902

J. Electron. Packag 118(2), 55-61 (Jun 01, 1996) (7 pages) doi:10.1115/1.2792132 History: Received January 01, 1996; Revised March 01, 1996; Online November 06, 2007

Abstract

The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

Copyright © 1996 by The American Society of Mechanical Engineers
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