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TECHNICAL PAPERS

Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

[+] Author and Article Information
Zhenfeng Guo, Hans Conrad

Materials Science and Engineering Department, North Carolina State University, Raleigh, NC 27695-7907

J. Electron. Packag 118(2), 49-54 (Jun 01, 1996) (6 pages) doi:10.1115/1.2792131 History: Received January 01, 1996; Revised March 01, 1996; Online November 06, 2007

Abstract

An increased cooling rate following reflow produced a decrease in the microstructure size including the size of the colonies, the Pb-rich dendrites and the eutectic phases. The decrease in microstructure size gave an increased creep rate at room temperature and a decrease in the creep stress exponent. Also, thermo-mechanical fatigue crack growth rate decreased and fatigue life increased with the decrease in microstructure size. These effects of the increased cooling rate were attributed to an increase in boundary sliding which could occur from the increase in boundary area with decrease in microstructure size.

Copyright © 1996 by The American Society of Mechanical Engineers
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