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TECHNICAL PAPERS

Fatigue Crack Initiation in Solder Joints

[+] Author and Article Information
Z. Zhang, Daping Yao, J. K. Shang

Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801

J. Electron. Packag 118(2), 41-44 (Jun 01, 1996) (4 pages) doi:10.1115/1.2792129 History: Received January 01, 1996; Revised March 01, 1996; Online November 06, 2007

Abstract

A backface strain technique is introduced to examine fatigue crack initiation in solder lap joints. The technique detects the fatigue crack initiation by monitoring the backface strain at the end of the overlap. Variation of the backface strain with the development of a crack was simulated by finite element method. The simulation indicated that the backface strain at the end of the overlap reached a peak value when a fatigue crack initiated. Experimental verification was carried out in 63Sn-37Pb solder joints. The backface strain was recorded as a function of stress cycle to demonstrate the applicability of this technique. Experimental results showed that fatigue crack initiation took about half of the fatigue lifetime of the solder joints.

Copyright © 1996 by The American Society of Mechanical Engineers
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