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TECHNICAL BRIEF

A Model for Deformation of Solder Bumps From Ramp Loading

J. Electron. Packag 118(1), 37-40 (Mar 01, 1996) (4 pages) doi:10.1115/1.2792125 History: Received July 01, 1994; Revised July 05, 1995; Online November 06, 2007

Abstract

A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability.

Copyright © 1996 by The American Society of Mechanical Engineers
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