Statistical Model for the Inherent Tilt of Flip-Chips

[+] Author and Article Information
Lewis S. Goldmann

IBM Microelectronics Division, East Fishkill Facility, Hopewell Junction, NY

J. Electron. Packag 118(1), 16-20 (Mar 01, 1996) (5 pages) doi:10.1115/1.2792120 History: Received March 02, 1994; Revised December 11, 1995; Online November 06, 2007


The tilt of flip-chips is becoming increasingly important in optical and high-power electronic applications. This paper outlines the principal sources of tilt, and presents a mathematical algorithm for the statistical variation in inherent tilt, the component related to variability of solder pad dimensions. With the assistance of a Monte Carlo simulation, closed form equations are developed for several common families of symmetric pad footprints. Possible extension of the analytical tools to other important cases is discussed.

Copyright © 1996 by The American Society of Mechanical Engineers
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