Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

[+] Author and Article Information
Y. S. Son, T. L. Bergman

Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX 78712

M. T. Hyun

Department of Mechanical Engineering, Cheju National University, Cheju-Do, 690-756 Korea

J. Electron. Packag 117(4), 317-322 (Dec 01, 1995) (6 pages) doi:10.1115/1.2792111 History: Received October 23, 1993; Revised July 28, 1995; Online November 06, 2007


Reflow soldering with nitrogen injection is simulated. Soldering is performed in a process oven that is equipped with porous panel heaters through which air or nitrogen is introduced to the reflow environment. The injected gas is introduced selectively through top or bottom infrared heaters in order to dampen temperature fluctuations which can be established by thermal buoyancy forces in the oven gas. The heat transfer processes are simulated using an existing, general numerical model that accounts for multimode effects, and is capable of predicting large and small scale thermal and species concentration phenomena. With selective injection, it is shown that high frequency convective heating and/or cooling of the card assembly can be eliminated, and oxygen concentrations in the reflow section can be controlled to low levels.

Copyright © 1995 by The American Society of Mechanical Engineers
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