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TECHNICAL PAPERS

Integrated Infrared Failure Analysis of Printed Circuit Boards

[+] Author and Article Information
J. J. Miles, J. M. Kliman, J. E. Sunderland

Department of Mechanical Engineering, University of Massachusetts, Amherst, MA 01003

C. R. Zelak

Digital Equipment Corporation, 20 Kimball Ave, South Burlington, VT 05403

J. Electron. Packag 117(4), 288-293 (Dec 01, 1995) (6 pages) doi:10.1115/1.2792107 History: Received October 15, 1993; Revised February 03, 1995; Online November 06, 2007

Abstract

A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addressed, testing procedures are described, and favorable results are presented. The feasibility of an infrared test process is demonstrated.

Copyright © 1995 by The American Society of Mechanical Engineers
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