Boundary Layer Fracture in Composite Solder Joints

[+] Author and Article Information
Roger B. Clough, Alexander J. Shapiro

National Institute of Standards and Technology, Gaithersburg, MD 20899

Andrew J. Bayba, George K. Lucey

Army Research Laboratory, Adelphi, MD 20783

J. Electron. Packag 117(4), 270-274 (Dec 01, 1995) (5 pages) doi:10.1115/1.2792104 History: Received August 15, 1994; Revised June 28, 1995; Online November 06, 2007


Composite solder connections, modeled as miniature single-lap shear layers between copper plates, were fabricated and pulled to fracture. The solder layers (3.1 × 3.1 × 0.50 mm) were eutectic lead-tin/particulate Cu6 Sn5 composites. Under load, shear fractures extended along paths about 10 µm inside of the interfaces from opposite edges. These boundary layer fractures were characterized and a fracture model was developed. A corresponding test method for measuring JII and δII , the crack extension energy and crack tip shear displacement for Mode II crack growth, is given, and the results are discussed. Composite strengthening is shown to significantly improve the ductility and the creep life, properties associated with improved reliability and creepfatigue life.

Copyright © 1995 by The American Society of Mechanical Engineers
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