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TECHNICAL PAPERS

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

[+] Author and Article Information
Mary J. Li, Michael Pecht

CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland

J. Electron. Packag 117(3), 225-229 (Sep 01, 1995) (5 pages) doi:10.1115/1.2792096 History: Received November 02, 1993; Revised February 07, 1995; Online November 06, 2007

Abstract

Environmental Scanning Electron Microscopy (E-SEM) is a technique which provides the capability to investigate surface morphologies over a variety of controllable environmental conditions. This paper discusses the principal of the E-SEM and presents three experimental investigations of failure mechanisms in electronic packages using E-SEM techniques. The first is a study of thermally induced failures of MMIC devices. The second investigation focuses on mechano-sorptive properties of multilayer thin-film polyimides. The third investigation concentrates on relative humidity and thermal cycling effects on interfacial bonding characteristics of resin/fiber interfaces in printed wiring boards, and microcracks surrounding plated-through-holes.

Copyright © 1995 by The American Society of Mechanical Engineers
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