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TECHNICAL PAPERS

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

[+] Author and Article Information
K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen

Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104-6315

J. Electron. Packag 117(3), 220-224 (Sep 01, 1995) (5 pages) doi:10.1115/1.2792095 History: Received July 01, 1994; Revised December 21, 1994; Online November 06, 2007

Abstract

In this part the heat, mass, and momentum transfer within a curing over that is commonly used in microelectronic manufacturing have been numerically analyzed. The local partial pressure of the vapor is a determining factor in the promotion of contamination. Based on the results of this study a new design is recommended. The significant features of the new design are: (i) ability to maintain the partial pressure of the vapor below the saturation pressure corresponding to the temperature at every location within the oven, and (ii) improved facility for scavenging of the vapor. Qualitative comparisons of results obtained here with flow visualizations (Part I) are excellent.

Copyright © 1995 by The American Society of Mechanical Engineers
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