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TECHNICAL PAPERS

Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry

[+] Author and Article Information
B. Han, Y. Guo

IBM Microelectronics Division, IBM Corporation, Endicott, NY 13760

J. Electron. Packag 117(3), 185-191 (Sep 01, 1995) (7 pages) doi:10.1115/1.2792090 History: Received August 01, 1994; Revised May 12, 1995; Online November 06, 2007

Abstract

Thermo-mechanical behavior of various levels of electronic packaging products is studied by moiré and microscopic moiré interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

Copyright © 1995 by The American Society of Mechanical Engineers
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