Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry

[+] Author and Article Information
B. Han, Y. Guo

IBM Microelectronics Division, IBM Corporation, Endicott, NY 13760

J. Electron. Packag 117(3), 185-191 (Sep 01, 1995) (7 pages) doi:10.1115/1.2792090 History: Received August 01, 1994; Revised May 12, 1995; Online November 06, 2007


Thermo-mechanical behavior of various levels of electronic packaging products is studied by moiré and microscopic moiré interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In