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TECHNICAL PAPERS

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

[+] Author and Article Information
Sejin Han, K. K. Wang

Cornell Injection Molding Program, Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY 14853

J. Electron. Packag 117(3), 178-184 (Sep 01, 1995) (7 pages) doi:10.1115/1.2792089 History: Received October 02, 1993; Revised June 05, 1995; Online November 06, 2007

Abstract

An effort has been made in this study to develop a model which can predict wire sweep during semiconductor chip encapsulation with transfer molding. The calculation of wire sweep during encapsulation depends on many factors. In this study, a step-by-step approach has been used considering one factor at a time. As the first step, the wire deformation has been measured and calculated under a known dead-weight loading. The next step has been to measure and calculate the deformation of a single straight wire attached to the mid-plane of a rectangular cavity due to the flow of a clear and homogeneous fluid. Finally, the wire deformation due to the flow has been measured and calculated when a wire of general shape is attached to a leadframe. The effect of bubble on the wire-sweep has been analyzed qualitatively. Through this series of experiments, a first step in the development of model for the prediction of wire sweep during chip encapsulation has been made.

Copyright © 1995 by The American Society of Mechanical Engineers
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