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TECHNICAL PAPERS

Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

[+] Author and Article Information
Peter A. Engel, Shou-Chien Chou

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902

J. Electron. Packag 117(2), 136-140 (Jun 01, 1995) (5 pages) doi:10.1115/1.2792080 History: Received August 01, 1994; Revised April 08, 1995; Online November 06, 2007

Abstract

In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. Comparisons with elastic solder foundation calculation results show that thermal and inelastic solder stress/strain dependence should be included especially in the higher (over 75°C) temperature range.

Copyright © 1995 by The American Society of Mechanical Engineers
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