0
RESEARCH PAPERS

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

[+] Author and Article Information
Ann M. Anderson

Department of Mechanical Engineering, Union College, Schenectady, NY 12308

J. Electron. Packag 116(4), 310-316 (Dec 01, 1994) (7 pages) doi:10.1115/1.2905703 History: Received October 20, 1993; Revised July 07, 1994; Online April 28, 2008

Abstract

In many heat transfer situations, such as those found in the electronics cooling field, more than a single mode of heat transfer occurs. For example, modules on a printed circuit board dissipate heat through convection to the air, through conduction to the board and through radiation to the surroundings. The adiabatic heat transfer coefficient, had , works well in such situations because it describes the change in wall temperature due to each incremental change in the convective heat transfer rate (due to conduction, radiation, or generation in the wall). The value of had is independent of the surface heat transfer distribution and can be used with the superposition method to interface between a convection solver and a conduction solver and “decouple” a conjugate heat transfer problem. If one uses the heat transfer coefficient based on the mean fluid temperature, hm , the problem is complicated because the value of hm is a function of the surface heat transfer distribution. This decoupling strategy is demonstrated through a series of numerical computations which solve the fully conjugate problem for laminar flow in a duct. These results are then compared to the decoupled solution. Excellent agreement between the fully conjugate and the decoupled solution is found for all cases when had and Tad are used to decouple the problem. Using hm and Tm can result in temperature prediction errors as large as 50 percent (for the cases studied here). The results show that when the Biot number (formulated as the resistance to axial wall conduction over the resistance to convection) is greater than 1.0 the adiabatic heat transfer coefficient should be used to decouple the problem. If the Biot number is below this value, h based on the mean temperature (for uniform surface temperature) can be used as the decoupler.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In