Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages

[+] Author and Article Information
Boris Mirman

Digital Equipment Corporation, 146 Main Street, Maynard, MA 01754

J. Electron. Packag 116(4), 258-264 (Dec 01, 1994) (7 pages) doi:10.1115/1.2905696 History: Received August 16, 1993; Revised September 15, 1994; Online April 28, 2008


This paper addresses the gap between optimistic and pessimistic analytical predictions of the reliability of microelectronic structures using the example of single chip ceramic packages. The necessity of structural (rather than material) characterization is emphasized. Equations for the probability of failure of a single chip ceramic package are presented.

Copyright © 1994 by The American Society of Mechanical Engineers
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