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RESEARCH PAPERS

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

[+] Author and Article Information
J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht

CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20740

J. Electron. Packag 116(2), 148-153 (Jun 01, 1994) (6 pages) doi:10.1115/1.2905503 History: Received October 31, 1992; Revised January 20, 1994; Online April 28, 2008

Abstract

Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporate into the design models for multichip modules and other electronic packages. These properties are also required in assessing reliability and aiding in screening and qualification procedures. This paper presents the test methods and experimental results on various thermomechanical properties of low temperature cofired ceramic over the the temperature range of −55°C to +250°C. Material properties determined from the tests include the modulus of elasticity, the modulus of rupture, the fracture toughness, and the coefficient of thermal expansion.

Copyright © 1994 by The American Society of Mechanical Engineers
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