0
RESEARCH PAPERS

Thermal Model of a PC

[+] Author and Article Information
Ronald L. Linton

Advanced Workstation Division, IBM, Acoustics/Thermal/Vibrations Lab, Austin, Texas

D. Agonafer

Enterprise Systems, IBM, Office of IBM Fellow, Poughkeepsie, NY

J. Electron. Packag 116(2), 134-137 (Jun 01, 1994) (4 pages) doi:10.1115/1.2905501 History: Received October 31, 1992; Revised January 20, 1994; Online April 28, 2008

Abstract

This paper presents an alternative approach to modeling box cooling in electronic packages. A finite-control-volume simulation code is used to simulate an IBM desktop Personal Computer. Only the geometry, the overall air flow rate, the turbulent viscosity and the power dissipations from each card must be specified. The simulation code predicts the flow distribution inside the PC, the convection coefficients, the turbulence effects, and the temperatures. Predicted component temperatures were compared to measured values.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In