Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

[+] Author and Article Information
H. D. Conway

Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853

P. Bo̸rgesen, C.-Y. Li

Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853

J. Electron. Packag 116(2), 110-115 (Jun 01, 1994) (6 pages) doi:10.1115/1.2905498 History: Received January 16, 1993; Revised March 08, 1994; Online April 28, 2008


An elastic analysis is developed to provide estimates of the stresses in area array solder joints during thermal excursions. The analysis provides a rapid quantitative evaluation of the important stresses during elastic deformation, and may serve as a basis for the qualitative understanding of the loading of interconnects during thermal and power cycles.

Copyright © 1994 by The American Society of Mechanical Engineers
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