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RESEARCH PAPERS

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

[+] Author and Article Information
M. K. Schwiebert

Hewlett-Packard Company, Palo Alto, CA 94303

J. Electron. Packag 116(2), 89-91 (Jun 01, 1994) (3 pages) doi:10.1115/1.2905510 History: Received August 01, 1993; Online April 28, 2008

Abstract

This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity.

Copyright © 1994 by The American Society of Mechanical Engineers
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