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RESEARCH PAPERS

Convective Heat Transfer Distribution on the Surface of an Electronic Package

[+] Author and Article Information
R. A. Wirtz, Ashok Mathur

Mechanical Engineering Department, University Of Nevada, Reno, Reno, NV 89557

J. Electron. Packag 116(1), 49-54 (Mar 01, 1994) (6 pages) doi:10.1115/1.2905493 History: Received April 15, 1992; Revised September 17, 1993; Online April 28, 2008

Abstract

Measurements of the distribution of convective heat transfer over the five exposed faces of a low profile electronic package are described. The package, of square planform and length-to-height ratio, L/a = 6 , is part of a regular array of such elements attached to one wall of a low aspect ratio channel. The coolant is air, and experiments are described for the Reynolds number range, 3000<Re<7000. The average heat transfer coefficient for the top face is found to be nearly equal to the overall average heat transfer coefficient for the element. The average heat transfer coefficient for the upstream face and two side faces are higher than the overall average by approximately 30–40 percent and 20–30 percent, respectively while that for the downstream face is 20–30 percent less than the overall average. Furthermore, the distribution in local heat transfer coefficient over the five surfaces of the element is approximately independent of variations in Reynolds number.

Copyright © 1994 by The American Society of Mechanical Engineers
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