0
RESEARCH PAPERS

Heat Transfer in Wire Bonding Process

[+] Author and Article Information
M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

Department of Mechanical Engineering and Applied Mechanics, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA 19104-6315

J. Electron. Packag 116(1), 44-48 (Mar 01, 1994) (5 pages) doi:10.1115/1.2905492 History: Received December 27, 1992; Revised November 01, 1993; Online April 28, 2008

Abstract

We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding process employed in microelectronic manufacturing. A set of continuum conservation equations has been solved to obtain the variation of electric potential, temperature distributions, and the electrode heat fluxes. Results indicate that the main body of the discharge is quasineutral bounded by space charge sheaths at both electrodes. Strong electric fields are concentrated in the electrode sheaths. The heat flux to the wire is sharply peaked near the wire tip but on the plane it decays slowly away from the discharge axis. The model studied here may be used to establish optimum discharge parameters for wire bonding.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In